This technology relates to visually-guided multiprobe microassembly for assembling micro-electromechanical (MEMS) devices from multiple parts that are assembled rather than using bulk-processes to produce devices monolithically. Current production technologies primarily use a single wafer that is process chemically to produce finished devices. While this is useful for many devices, it results in mechanical regions that exist primarily in the plane and do not have fully spatial mechanisms without significant depth of stacked parts. The chemical processes are also not always compatible with materials that would be desirable to use with a mechanical device. A multiprobe microassembly method according to this technology has limited material and part design requirements, does not require snap-fasteners that previous manipulation methods have required, and provides high tolerance control for creating fully spatial compliant micromechanisms with stacked components.