Todays integrated circuits often can include millions of integrated components and devices. However, for a given product, it sometimes is not possible to achieve on one chip all of the circuitry required. A major challenge then becomes the interconnection of the circuitry on mulitple chips or substrates while keeping the connection resistance low and path lengths short to minimize inductive and capacitive effects, permitting high speed operation. Thus, a structure and method of forming compact integrated circuit assemblies and interconnections is needed.

The current high-growth nature of digital communications demands higher speed serial communication circuits. Present day technologies barely manage to keep up with the present need to communicate at high speeds (e.g., gigabit, terabit, and higher transmission speeds). New techniques are needed to ensure that methods for serial communication can continue to expand and grow. A novel approach to high-frequency communications demands on serial communications circuits has been invented.

The current high-growth nature of digital communications demands higher speed serial communication circuits. Present day technologies barely manage to keep up with the present need to communicate at high speeds, e.g. gigabit, terabit, and higher transmission speeds. Multiplexers are often used but have different input and output rates, which can cause jitter in the output signal.