Rensselaer researchers have developed programmable directed mesoscopic self-assembly and energy-assisted placement processes suitable for high speed, high accuracy, and low-defect rate LED system packaging operations. Current LED packaging technology is handled one semiconductor device element at a time, and is limited to a speed of about 10K units per hour. New technology is needed to package these devices, as well as associated control devices, into integrated lighting systems at much higher speeds, up to 10K units per minute. Some current approaches, including die printing and mesoscopic self-assembly processes, are limited by the availability of manufacturable LED chip designs and defect rates associated with high speed placement errors. This technology includes high speed handling processes with magnetically assisted mesoscopic die self-assembly on optical templates with roll to roll format and laser assisted die printing onto templates where the tested LED wafer can be used as a print head to transfer known good die to substrates at high speed and with good placement accuracy and sub-ppm failure rates. These processes can be incorporated into flex circuit production and ultra- high speed packaging to produce large area arrays of LED die that can be interconnected to create sheets of light. The resulting system in a sheet will be usable in the development of a wide variety of advanced lighting systems. One application of this technology is the development of LED packaging systems. Advantages of this technology include: high-volume with low cost production, design flexibility and electrical structure pre-loaded optical substrate availability.