Rensselaer researchers have developed programmable directed mesoscopic self-assembly and energy-assisted placement processes suitable for high speed, high accuracy, and low-defect rate LED system packaging operations. Current LED packaging technology is handled one semiconductor device element at a time, and is limited to a speed of about 10K units per hour. New technology is needed to package these devices, as well as associated control devices, into integrated lighting systems at much higher speeds, up to 10K units per minute.