Self-assembled sub-nanolayers as interfacial adhesion enhancers and diffusion barriers

Isolating individual components of nanoscale architectures comprised of thin films or nanostructures, without significantly impacting their functionalities, is a critical challenge in micro- and nano-scale device fabrication. One example that illustrates this challenge is seen in Cu interconnect structures for nanometer devices. These devices use interfacial barrier nanolayers to isolate copper layers from dielectric layers.