technologies available for licensing

Rensselaer Polytechnic Institute has a variety of technologies ranging from chemicals to lighting systems to algorithms and everything in-between. Rensselaer’s technologies can help you start a company or be a great addition to your current technology portfolio. To see what technologies are currently available for licensing at Rensselaer, please use the search below. If you have a technology need that Rensselaer’s technologies don’t currently solve, please reach out to IPO to discuss more your needs.

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Interest and research activity in the photoinitiated cationic crosslinking polymerizations of multifunctional epoxide and oxetanes monomers have increased rapidly as this technology has found broad use in many industrial applications. However, while the synthesis of current epoxy-functional siloxanes yields monomers that undergo efficient cationic ring-opening…
This invention is directed to a method to improve the performance of stepper motor driven systems.Stepper motors are ubiquitous in modern office equipment and other machinery, yet little is published regarding their optimal use in open loop systems.Accurate control of a stepper motor is limited by the ability of the control system to approximate the actual motor and…
This invention is directed to a new, inexpensive analytical instrument that can be used to study and evaluate such essential parameters as light intensity, photoinitiator concentration, and monomer reactivity in a wide variety of UV photopolymerization curing applications. The device provides real-time information as the sample proceeds through the photoreactive phase. Through…
Currently, the most common semiconductor dielectric is silicon dioxide (SiO2), which has a dielectric constant of about 4.0. There is a substantial interest in materials with low dielectric constants that can replace SiO2-based insulators as inter layer dielectrics (ILD). This invention is directed to a new process for the preparation of low dielectric constant films. The sol-…
There is an increasing interest in using nanoparticles as building blocks for well-defined structures that have practical applications owing to the various novel properties of nanoparticles. However, their assembly is a challenging task. Methods based on surface functionalization, andor template patterning have been used for this purpose, but both of these processes can be…
Carbon nanotubes are a nanostructured material that promises to have a wide range of applications. However, the present techniques used to build nanotube architectures have several deficiencies, such as the inability to precisely and controllably align the nanotubes. This invention is a novel and powerful method to assemble carbon nanotubes on planar substrates to build and…
This invention is directed to a novel non-destructive method to remove excess layers of copper from microchip interconnect-metallization processing, allowing copper to be used in place of aluminum. The new method, an Electro-Chemical Planarization process, is a means of removing the copper in an electrolysis-designed solution bath without damaging the thin-film and…
Lookback is defined as the ability of a logical process to change its past locally (i.e. without involving other logical processes). Logical processes with lookback are able to process out-of-timestamp order events, enabling new synchronization protocols for the parallel discrete event simulation. This technology is directed to two of such protocols, LookBack-Global Virtual…
As part of the continuing effort to reduce the environmental impact of various industrial chemical processes, there has been a strong emphasis in developing new methodology for the application and cure of organic coatings. While these ubiquitous materials are absolutely essential to modern life, they also constitute one of the primary industrial Sources of emissions of…
For most types of gelatin-based imaging elements, surface abrasion and scratching results in reduction of image quality. Thus, processing the image and, later, casual handling of the image can easily mark or disfigure the image. There is, therefore, a need for an imaging element having improved scratch resistance over materials currently used. It has been unexpectedly…