technologies available for licensing

Rensselaer Polytechnic Institute has a variety of technologies ranging from chemicals to lighting systems to algorithms and everything in-between. Rensselaer’s technologies can help you start a company or be a great addition to your current technology portfolio. To see what technologies are currently available for licensing at Rensselaer, please use the search below. If you have a technology need that Rensselaer’s technologies don’t currently solve, please reach out to IPO to discuss more your needs.

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There are two basic classes of adhesives in widespread current use. The first class is pressure sensitive adhesives, such as are employed in adhesive tapes. The second class is reactive adhesives, used primarily for structural purposes. A long-standing problem with these types of adhesives is that they are unable of obtaining both a long working life and a rapid cure time.…
Isolating individual components of nanoscale architectures comprised of thin films or nanostructures, without significantly impacting their functionalities, is a critical challenge in micro- and nano-scale device fabrication. One example that illustrates this challenge is seen in Cu interconnect structures for nanometer devices. These devices use interfacial barrier nanolayers…
Interest and research activity in the photoinitiated cationic crosslinking polymerizations of multifunctional epoxide and oxetanes monomers have increased rapidly as this technology has found broad use in many industrial applications. However, while the synthesis of current epoxy-functional siloxanes yields monomers that undergo efficient cationic ring-opening…
Conventional technologies used for the generation of solar power include building-integrated flat-plate photovoltaic (PV) systems, and stand-alone concentrating PV systems that are removed from the location of power application. Although these technologies work, widespread adoption of them for general use has been hampered by a number of impediments, such as the large amount…
This invention is directed to a new, inexpensive analytical instrument that can be used to study and evaluate such essential parameters as light intensity, photoinitiator concentration, and monomer reactivity in a wide variety of UV photopolymerization curing applications. The device provides real-time information as the sample proceeds through the photoreactive phase. Through…
Currently, the most common semiconductor dielectric is silicon dioxide (SiO2), which has a dielectric constant of about 4.0. There is a substantial interest in materials with low dielectric constants that can replace SiO2-based insulators as inter layer dielectrics (ILD). This invention is directed to a new process for the preparation of low dielectric constant films. The sol-…
There is an increasing interest in using nanoparticles as building blocks for well-defined structures that have practical applications owing to the various novel properties of nanoparticles. However, their assembly is a challenging task. Methods based on surface functionalization, andor template patterning have been used for this purpose, but both of these processes can be…
Interest in biomolecules including proteins and oligonucleotides has exploded in recent years, but while supplies of raw materials are relatively abundant, an ongoing problem encountered is separation andor purification of these materials. Displacement chromatography can be used to perform such difficult separations in an efficient and cost effective manner. However, a major…
Carbon nanotubes are a nanostructured material that promises to have a wide range of applications. However, the present techniques used to build nanotube architectures have several deficiencies, such as the inability to precisely and controllably align the nanotubes. This invention is a novel and powerful method to assemble carbon nanotubes on planar substrates to build and…
This invention is directed to a novel non-destructive method to remove excess layers of copper from microchip interconnect-metallization processing, allowing copper to be used in place of aluminum. The new method, an Electro-Chemical Planarization process, is a means of removing the copper in an electrolysis-designed solution bath without damaging the thin-film and…