technologies available for licensing

Rensselaer Polytechnic Institute has a variety of technologies ranging from chemicals to lighting systems to algorithms and everything in-between. Rensselaer’s technologies can help you start a company or be a great addition to your current technology portfolio. To see what technologies are currently available for licensing at Rensselaer, please use the search below. If you have a technology need that Rensselaer’s technologies don’t currently solve, please reach out to IPO to discuss more your needs.

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Electrical impedance tomography (EIT) utilizes electrodes placed on the surface of a body to determine the complex conductivity distribution within the body. When using a voltage source in EIT, it is necessary to know both the applied voltage and the resulting current with high precision, which cannot be achieved with current systems. This invention is directed to a voltage…
For many decades, dry processing techniques, such as physical vapor deposition (PVD), have played a dominant role in integrated circuit metallization processes. During microelectronic device fabrication, films are often deposited on non-planar surfaces. The surface topography that wafers exhibit at various steps in the fabrication process arise from patterned features related…
Silicon Carbide (SiC) has long been recognized as the choice for high voltage, high temperature, and high power applications. To achieve optimum design in SiC power devices, a varying charge in the lateral direction should be introduced. To f orm a junction termination extension (JTE) in SiC, different implant doses into multiple spaced zones can be used to create a non-…
This invention is directed to a method and apparatus for growing a multi-component single crystal boules that provides high quality and growth rate by growing the crystal from a multi-component melt, such as a ternary, quaternary or higher order melt. In the past, only binary compounds such as GaAs) could be commercially produced by directional solidification from melts, while…
This invention is directed to a high-throughput process for screening proteins for kinetic stability.Kinetically stable proteins are trapped in one conformation and have a high barrier to unfolding, so they are resistant to aggregation and degradation and have a longer half-life.The ability to quickly and easily identify kinetically stable proteins would have a myriad of…
There are two basic classes of adhesives in widespread current use. The first class is pressure sensitive adhesives, such as are employed in adhesive tapes. The second class is reactive adhesives, used primarily for structural purposes. A long-standing problem with these types of adhesives is that they are unable of obtaining both a long working life and a rapid cure time.…
Isolating individual components of nanoscale architectures comprised of thin films or nanostructures, without significantly impacting their functionalities, is a critical challenge in micro- and nano-scale device fabrication. One example that illustrates this challenge is seen in Cu interconnect structures for nanometer devices. These devices use interfacial barrier nanolayers…
Interest and research activity in the photoinitiated cationic crosslinking polymerizations of multifunctional epoxide and oxetanes monomers have increased rapidly as this technology has found broad use in many industrial applications. However, while the synthesis of current epoxy-functional siloxanes yields monomers that undergo efficient cationic ring-opening…
This invention is directed to a new, inexpensive analytical instrument that can be used to study and evaluate such essential parameters as light intensity, photoinitiator concentration, and monomer reactivity in a wide variety of UV photopolymerization curing applications. The device provides real-time information as the sample proceeds through the photoreactive phase. Through…
Currently, the most common semiconductor dielectric is silicon dioxide (SiO2), which has a dielectric constant of about 4.0. There is a substantial interest in materials with low dielectric constants that can replace SiO2-based insulators as inter layer dielectrics (ILD). This invention is directed to a new process for the preparation of low dielectric constant films. The sol-…