technologies available for licensing

Rensselaer Polytechnic Institute has a variety of technologies ranging from chemicals to lighting systems to algorithms and everything in-between. Rensselaer’s technologies can help you start a company or be a great addition to your current technology portfolio. To see what technologies are currently available for licensing at Rensselaer, please use the search below. If you have a technology need that Rensselaer’s technologies don’t currently solve, please reach out to IPO to discuss more your needs.

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Terahertz (THz) waves occupy a segment of the electromagnetic spectrum between the infrared and microwave bands. As such, they can be used for imaging and sensing in ways that are not possible with conventional technologies such as X-ray and microwave. Because THz radiation transmits through almost anything that is not metal or liquid, the waves can see through most materials…
Atomic layer deposition (ALD) is an ideal technique for fabricating thin layers requiring precision-controlled nanoscale film thickness. It is a type of chemical vapor deposition (CVD), wherein a film is built up through deposition of multiple ultra thin layers of atomic level controllability, with the thickness of the ultimate film being determined by the number of layers…
RECON is an algorithm for the rapid reconstruction of molecular charge densities and charge density-based electronic properties of molecules, using atomic charge density fragments precomputed from ab initio wave functions. The method is based on Bader's quantum theory of Atoms in Molecules. A library of atomic charge density fragments has been built in a form that allows for…
Cationic polymerization is employed in many commercially important applications, including, for example, decorative and abrasion resistant coatings, printing inks, adhesives, fiber reinforced composites, microelectronic encapsulations, tan coatings, pressure sensitive adhesives, high performance aerospace composites, fiber optic coatings, stereolithography, photoresist and…