Todays integrated circuits often can include millions of integrated components and devices. However, for a given product, it sometimes is not possible to achieve on one chip all of the circuitry required. A major challenge then becomes the interconnection of the circuitry on mulitple chips or substrates while keeping the connection resistance low and path lengths short to minimize inductive and capacitive effects, permitting high speed operation. Thus, a structure and method of forming compact integrated circuit assemblies and interconnections is needed.